Imec has developed device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. Functional GaN MISHEMTs were processed using standard CMOS tools by imec and their GaN industrial affiliation program (IIAP) partners. The used processes are compatible with the strict contamination rules in a standard CMOS processing line (without the use of gold). Read more: Imec [...]
Texas Memory Systems announced the RamSan-70 900 GB half-length PCIe card. The RamSan-70 features Toshiba 32nm SLC Flash, TMS Series-7 Flash Controller, 330k IOPS and 2 GB/s of bandwidth. The field-upgradable Series-7 Flash Controller handles all Flash management functions without impacting the host CPU. The RamSan-70 is scheduled for initial delivery in 4-8 weeks. It [...]
Cadence Design Systems introduced DFM Services for TSMC 40-nanometer technology and below. The design-for-manufacturing (DFM) services include model-based simulation of litho-process checks (LPC) and virtual chemical mechanical polishing (CMP) verification for designs down to 28nm. The goal is to help design teams effectively detect litho or CMP hotspots and fix them prior to tapeout. Cadence [...]
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